Lab Safety

Below find links to the two handouts given in the lab safety session presented by Ausrine Karatis on 5/7/01. They contain information about hazards, handling and disposal of chemicals that you will be working with in the NCF.

General Introduction

Chemicals

Below please find list of MSDS (Material Safety Data Sheets) of chemicals and gases used in the NCF:

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

A
	Acetic Acid
	Acetone
	Adhesion Promoter for Parylene (MEOPTS)
	Adhesion Promoter for Photoresist
	Aluminum Etch
	Aluminum Metal
	Ammonia (NH3)
	Ammonium Hydroxide (NH4OH)
	Argon Gas (Ar)
B
	Buffered Oxide Etch (BOE)
	Bromine
C
	Cesioum Hydroxide (CsOH)
	Chromium Metal (Cr)
	Copper Metal (Cu)
D
	Dichlorosilane Gas (SiH2Cl2)
E
	Ethanol
H
	Helium in Oxygen (He+O2)
	HMDS
	Hydrobromic Acid (HBr)
	Hydrochloric Acid (HCl)
	Hydrofluoric Acid (HF)
	Hydrogen Gas (H2)
	Hydrogen Peroxide (H2O2)
I
	Isopropanol
K
	KOH (Potassium Hydroxide)
M
	MAOPTS (Adhesion Promoter for Parylene)
	Methanol (CH3OH)
	Microposit 1112A Remover
	Microposit 1165 Remover
	Microposit 351 Developer Concentrate
N
	Nickel Metal (Ni)
	Niric Acid (HNO3)
	Nitrogen, LIN (liquid N2)
	Nitrous Oxide (N2O)
O
	Oxygen Gas (O2)
P
	Phosphoric Acid (H3PO4 in H2O)
	Potassium Hydroxide (KOH)
S
	Shipley 1818 Photoresist
	Silane Gas (SiH4)
	Sulfur Hexafluoride (SF6)
	Sulfuric Acid (H2SO4)
	Summa Clean
T
	Tetrafluoromethane Gas (CF4)
	Titanium Metal (Ti)
	Toluene
	Trichloroethane (TCE C2H3Cl3)
	Trifluoromethane Gas (CHF3)
	Trimethylchlorosilane ((CH3)3ClSi)
	Tungsten Hexafluoride (WF6)

 

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